There's been a lot of talk within the mobile community about how Samsung is doing with their 10nm FinFET process. This is what will be used to manufacture the upcoming Snapdragon 835 SoC from Qualcomm, as well as their own Exynos 8895 chip. We first heard about this issue a couple of weeks ago when a report out of South Korea claimed unsatisfactory yield of the 10nm FinFET process was going to be causing a delay in devices that used these two SoCs.
Samsung wouldn't be the only mobile chip fabricator that has had to delay the release of a 10nm SoC, since we saw TSMC do the exact same thing with the Helio X30 chip. The smaller these chips get, the harder it is for companies to make them properly. At the speed in which the mobile industry is running, these companies are constantly trying to best the other and beat their competition to the market. Still, this was just a single report and there weren't any official words that backed them up.
A few days later though, a rumor came out that said Samsung's original plan to launch the Galaxy S8 on April 21st was to be delayed a full week until April 28th. Again, this was still a rumor and Samsung hadn't even officially announced April 21st as the launch date for the device. But with these two pieces of news coming in back to back, it seemed to reaffirm that there was some sort of issue with Samsung's 10nm FinFET process that ended up causing this delay.
While that could still technically be the case, Samsung has now come out and said they are on track to ramp-up production of their 10nm FinFET process. They announced the company has shipped more than 70,000 silicon wafers of its first-generation 10nm LPE (Low Power Early) since it began in October of last year. They even specifically stated that they're seeing "steady high yield" of the process technology and that everything was on schedule.
Source: Samsung Newsroom
from xda-developers http://ift.tt/2m4VOD6
via IFTTT
Aucun commentaire:
Enregistrer un commentaire